THERMAL CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THE THERMAL CONDUCTIVE MEMBER, HEAT RADIATING COMPONENT, AND SEMICONDUCTOR PACKAGE

摘要

A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer.