| 摘要 |
Provided is a substrate cutting apparatus (1) by which a tray (5) storing cut substrates (3) (separate packages (4)) formed by cutting a molded substrate is efficiently transferred, and the packages (4) are efficiently manufactured. In a package storing unit (D) of the substrate cutting apparatus (1), at the time of separately transferring tray-placed members (27) having trays (5) placed thereon, in one way on an annular transfer region (37) including an upper transfer region (36) and a lower transfer region (35), a tray (6 (7)) storing the packages (4) is transferred from a package storing position (15) to a position (34) where the tray having the packages stored therein is to be taken out, and at the same time, a stand-by tray (5) detected at a shift detection position (16) is moved to the package storing position (15). |
