发明名称 APPLICATION OF RESIN MOLDING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an application of a resin molding comprising optical-curing a photopolymerizable composition, an application of a resin molding which is excellent in especially optical characteristics, heat characteristics, and mechanical characteristics, and is especially useful as a flexible plastic substrate for a display, and further an application of a wide and long film roll obtained by continuation light molding. <P>SOLUTION: A resin molding obtained by optical-curing a (meth)acrylate based photopolymerizable composition [I] is used in a gas barrier film, a transparent conductive film, an organic electroluminescent element, and a touch panel. In the resin molding, thickness is 50-400μm, and surface pencil hardness is at least 4H. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011073446(A) 申请公布日期 2011.04.14
申请号 JP20100213466 申请日期 2010.09.24
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 HAYAKAWA SEIICHIRO;KATSUMA KATSUHIKO
分类号 B32B27/30;C08J7/04;C23C14/20;G06F3/041;H01B5/14;H01L51/50;H05B33/02;H05B33/04;H05B33/28 主分类号 B32B27/30
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