发明名称 SLOT DIE APPARATUS
摘要 PROBLEM TO BE SOLVED: To suppress the thickening of an end of a formed resin film. SOLUTION: A molten resin R1 is supplied to a manifold 3, passes through a slot 4 communicating with the manifold 3, and is molded in a shape of a film. First and second inner deckles 11 and 12 which designate width dimensions of the manifold 3 and the slot 4 from both ends of the manifold 3 and the slot 4 and guide the passing molten resin R1 are provided. With regard to the first and second inner deckles 11 and 12, the surfaces 11a and 12a at the side of the passage of the molten resin R2 are bent concavely in a cross section perpendicular to the passage direction of the molten resin R1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011073156(A) 申请公布日期 2011.04.14
申请号 JP20090224023 申请日期 2009.09.29
申请人 TOPPAN PRINTING CO LTD 发明人 OTA SHINJI
分类号 B29C47/16;B29L7/00 主分类号 B29C47/16
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