| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high mounting reliability, and also to provide a method for manufacturing the device. <P>SOLUTION: The semiconductor device includes: semiconductor structure units 13, 14; interconnect layers 16, 17 provided on a major surface side of the semiconductor structure units; electrode pads 21, 22 provided on a surface of the interconnect layer on a side opposite to a surface on which the semiconductor structure unit is provided, and electrically connected to the interconnect layer; a plurality of metal pillars 31 joined to the electrode pads 21, 22 separately from each other; and external terminals 41 provided commonly at tips of the plurality of the metal pillars 31. The metal pillars 31 each have a diameter smaller than the diameter of the external terminal 41. <P>COPYRIGHT: (C)2011,JPO&INPIT |
