发明名称 RADIATION IMAGE PICKUP DEVICE
摘要 <p>A flexible insulating substrate (1) is provided with pixels (20) in matrix, and in the insulating substrate, a plurality of scanning wiring lines (101), wherein control signals that switch TFT switches (4) of respective pixels (20) are transmitted, and a plurality of signal wiring lines (3), wherein electrical signals that correspond to charges accumulated in the pixels are transmitted corresponding to the switching state of respective TFT switches (4), are provided with an insulating film between the scanning wiring lines and the signal wiring lines. On the insulating substrate, a gate IC (104), which outputs control signals, and an amplifier IC (105), which detects the electrical signals transmitted in the signal wiring lines, are provided. A control circuit (120) which controls operations of the gate IC (104) and the amplifier IC (105) is provided on one side or facing two sides of the insulating substrate (1). With such configuration, a radiation image pickup device which can be bent and can stably pick up a radiation image is provided.</p>
申请公布号 WO2011040079(A1) 申请公布日期 2011.04.07
申请号 WO2010JP57835 申请日期 2010.05.07
申请人 FUJIFILM CORPORATION;OKADA, YOSHIHIRO 发明人 OKADA, YOSHIHIRO
分类号 H01L27/146;G01T7/00;A61B6/00;G01T1/20;H01L27/14;H04N5/32 主分类号 H01L27/146
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