| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method that achieves high flatness of a polished surface of a polishing body after CMP processing, and further reduces the defect density of scratches or the like on the polishing surface of the polishing body compared with the conventional one. <P>SOLUTION: The polishing method includes: a conditioning step for spraying a conditioning agent, containing liquid, at a prescribed pressure on the surface of a non-foaming polishing pad 22 arranged on a polishing table 21; and a polishing step for polishing the surface of a polishing body 20 by supplying polishing slurry, containing cerium oxide particles and a surfactant, to the polishing pad 22 and by sliding the polishing body 20 and the polishing pad 22 relative to each other. The cross-section of the polishing pad 22 after the conditioning step is configured such that an average value of an amount of residual cerium when measuring several points in a measuring region of 200 μm<SP>2</SP>including the surface of the polishing pad 22 is set to ≤0.35 at%. <P>COPYRIGHT: (C)2011,JPO&INPIT |
