DUAL POROSITY STRUCTURE POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad reducing defects and increasing polishing speed.

SOLUTION: A porous polishing layer includes a dual porosity structure in a polyurethane matrix. The dual porosity structure includes a primary set of pores having pore walls with a thickness of 15 to 55 μm and a storage modulus of 10 to 60 MPa measured at 25°C. In addition, the pore walls contain a secondary set of pores having an average pore size of 5 to 30 μm. The porous polishing layer is either fixed to a polymeric film or sheet substrate or formed into a woven or non-woven structure to form the polishing pad.

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