| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck table for a semiconductor wafer, and a method of processing the semiconductor wafer, which improve product yield by omitting the operations of attaching and releasing an adhesive tape, and the discarding process thereof, thereby eliminating the operation of removing the adhesive remained on a bump surface of the semiconductor wafer. SOLUTION: The table suckingly holds the bump surface of the semiconductor wafer 1 with a plurality of bumps 3 by the action of negative pressure. The table includes a table body 10 having an enlarged diameter than the semiconductor wafer 1; and a porous suction mounting plate 20 fitted into the table body 10, and having substantially the same diameter as the semiconductor wafer 1 and opposed to the bump surface thereof. A storing recess 21 for storing the plurality of bumps 3 of the semiconductor wafer 1 is formed on an opposing surface of the suction mounting plate 20. A porous spacer 30 is interposed in the space between the plurality of bumps 3 and the storing recess 21. There is no need to attach the adhesive tape intended for the bumps onto the bump surface of the semiconductor wafer 1 because vacuum suction is carried out by storing and protecting the bumps 3 of the semiconductor wafer 1 in the storing recess 21. COPYRIGHT: (C)2011,JPO&INPIT |
