| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology appropriately forming an electronic component having a form having a body projected from a resin package by a minute length. <P>SOLUTION: The method for manufacturing an electronic component having a form where an electronic element conductively-connected to a plurality of conductors is sealed by a resin package, and at least one conductor out of the plurality of conductors is projected from the resin package by a minute length. In the method of manufacturing an electronic component using a manufacturing frame 6 where a plurality of electronic component formation regions are set, and a plurality of conductor members 62, 63 to become the conductors are formed for each electronic component formation region, a semiconductor chip 3 is mounted in each electronic component formation region; thereafter the resin package is formed so that one or more conductor members 62, 63 out of the plurality of conductor members project; recessed parts 65 are formed in parts extremely adjacent to the resin package 5 in the conductor members 62, 63; and thereafter the conductor members 62, 63 are cut. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
