METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

摘要

A method of forming a wire bond using a bonding tool supported by a transducer of a wire bonding machine is provided. The method includes the steps of: (1) lowering a free air ball positioned at a tip of the bonding tool toward a bonding location such that the free air ball contacts the bonding location; (2) applying electrical energy to the transducer to provide a scrubbing motion of the tip of the bonding tool during and prior to the contact of the free air ball to the bonding location; and (3) removing the application of the electrical energy immediately upon the free air ball being deformed to form the wire bond