| 发明名称 |
BONDING MATERIAL FOR HONEYCOMB STRUCTURE AND HONEYCOMB STRUCTURE UTILIZING THE MATERIAL |
| 摘要 |
<p>A bonding material for a honeycomb structure comprises inorganic particles in which D90/D10 is from 10 to 500, D10 is 100 µm or less and D90 is 4 µm or more, and the D10 and D90 are the values of 10% diameter and 90% diameter from a smaller particle diameter side, respectively, in volume-based integrated fractions of a particle diameter distribution measurement by a laser diffraction/scattering method.</p> |
| 申请公布号 |
EP2174921(A4) |
申请公布日期 |
2011.03.30 |
| 申请号 |
EP20080791603 |
申请日期 |
2008.07.25 |
| 申请人 |
NGK INSULATORS, LTD. |
发明人 |
WATANABE, ATSUSHI;KODAMA, SUGURU;ICHIKAWA, SHUICHI;SATO, FUMIHARU |
| 分类号 |
C04B37/00;B01D39/20;B01D46/00;B01J35/04;C04B38/00 |
主分类号 |
C04B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
