| 摘要 |
PURPOSE: A thermal spread chip heat sink is provided to efficiently improve heat radiation and dispersion by making the rear side of a heat sink smaller than the surface and external surface of the heat sink. CONSTITUTION: In a thermal spread chip heat sink, a plurality of grooves(16) are formed in the side of a heat sink(10). The cross-sectional area of a lower body(20a) making up the heat sink is smaller than the that of an upper body(20b). The heat sink is comprised of one of copper, copper alloy, aluminum, nickel, and nickel alloy. Plated heat sink is reel-carrier tapped by vacuum pick-up At least one heat sink is applied to at least one conductive pattern to in order to increase heat radiation and dispersion. |
