| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of carrying wafers and a wafer carrying device capable of separating the semiconductor wafers one by one without using manpower after cutting, for example, by a wire saw. SOLUTION: The method of carrying wafers for carrying a plurality of stacked wafers Wf includes a process for jetting a liquid Lq toward the end face of the plurality of wafers Wf to generate a gap among the plurality of wafers Wf positioned within the liquid Lq and a process for picking up the wafers Wf positioned at least at the uppermost part from among the plurality of wafers Wf while the gap has been generated. COPYRIGHT: (C)2011,JPO&INPIT
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