发明名称 Interconnect structure of semiconductor integrated circuit, and design method and device therefor
摘要 A method for designing an interconnect structure of an interconnect layer in a semiconductor integrated circuit device includes the steps of: (a) inputting layout data of the semiconductor integrated circuit device; (b) controlling an air gap exclusion area based interconnects in the layout data; and (c) outputting layout data including the air gap exclusion area determined in the step (b).
申请公布号 US7913221(B2) 申请公布日期 2011.03.22
申请号 US20070907999 申请日期 2007.10.19
申请人 PANASONIC CORPORATION 发明人 MIYASHITA HIROFUMI;KABUO CHIE;IWAUCHI NOBUYUKI;MATSUMURA YOICHI;KIMURA FUMIHIRO;GOU TATSUO;HASHIMOTO YUKIJI
分类号 G06F17/50;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L23/522;H01L23/532;H01L27/04 主分类号 G06F17/50
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