发明名称 Photoelectric sensor housing assembling method and photoelectric sensor
摘要 A housing assembly method for bonding through causing a first member and a second member, which form a tightly sealed housing that contains a sensing element, to be mutually abutting. A first resin material through which a laser beam passes is used as the first member and a second resin material that absorbs the laser beam is used as the member of the second piece. With the bonding surfaces of these members abutting each other, a laser beam having a diameter that is smaller than the width of the bonding surfaces is directed towards the bonding surfaces from the member of the first piece side to weld the bonding surfaces together while leaving non-welded portions between the abutting bonding surfaces.
申请公布号 EP2184784(A3) 申请公布日期 2011.03.16
申请号 EP20090175314 申请日期 2009.11.06
申请人 YAMATAKE CORPORATION 发明人 SUZUKI, HISASHI;SOEDA, KENICHI;AIZAWA, HIDEYUKI
分类号 H01L31/0203;H01L27/146;H01L31/18 主分类号 H01L31/0203
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