| 摘要 |
A device for measuring or inspecting substrates of the semiconductor industry, including a base frame and a module detachably mounted thereon via a module frame, wherein the module frame is detachably connected to the base frame via at least two self-aligning coupling elements and at least one alignment element, wherein the base frame and the module frame are in exactly defined spatial alignment with each other, when the module frame is detachably connected to the base frame.
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