发明名称 SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH HEAD, AND HARD DISK DRIVE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for suspension of which the whole thickness can be reduced, and which can be manufactured efficiently. SOLUTION: A substrate 1 for suspension includes an insulation layer 2, a first conductor 3 provided at one side plane of this insulation layer 2, a second conductor 4 provided at the other side plane of the insulation layer 2, and a metal substrate 5 laminated on the second conductor 4. Grooves 6 are formed at the second conductor 4 and the metal substrate 5 out of the above, the second conductor 4 comprises a plurality of second conductor part 4a and 4b separated through the groove 6. Also, the metal substrate 5 comprises a plurality of metal substrate parts 5a corresponding to respective second conductor parts 4a, 4b. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011048887(A) 申请公布日期 2011.03.10
申请号 JP20090198156 申请日期 2009.08.28
申请人 DAINIPPON PRINTING CO LTD 发明人 HIRATA KENRO
分类号 G11B5/60;G11B21/21;H05K1/02;H05K1/05 主分类号 G11B5/60
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