发明名称 |
VERFAHREN SOWIE DATEN ZUR HERSTELLUNG EINER LEITERPLATTE |
摘要 |
In the process of forming a through-hole or blind-hole at desired positions of a the substrate material, the present invention sets a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and performs a plurality of drillings at the drilling target position and the plurality of auxiliary drilling positions. In another preferred embodiment of the present invention, a plurality of drillings are performed only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under a single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs. |
申请公布号 |
DE60143951(D1) |
申请公布日期 |
2011.03.10 |
申请号 |
DE2001643951 |
申请日期 |
2001.10.10 |
申请人 |
PANASONIC CORPORATION |
发明人 |
NISHII, TOSHIHIRO;YAMAJI, HIROSHI;KIMURA, TADAO |
分类号 |
B26F1/00;B26F1/16;B23B35/00;B23K26/00;B23K26/06;B23K26/38;B23K101/42;H05K1/02;H05K3/00;H05K3/40;H05K3/42 |
主分类号 |
B26F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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