| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make intervals between LSI chips of a multi-chip module narrow. <P>SOLUTION: LSI chips 30A to 30D electrically connected to a package substrate 10 are connected by a wiring pattern 26a of a silicon interposer 20 disposed on the opposite side from the package substrate, and a thin film circuit 31 of an LSI chip and the wiring pattern 26a of the silicon interposer 20 are electrically connected to each other through a via hole 32 formed penetrating the LSI chip. Consequently, each of the LSI chips can be electrically connected to another LSI chip through the silicon interposer 20 while securing electric connection with the package substrate, and the wiring pattern of the silicon interposer 20 can be made fine separately from the package substrate, thereby making intervals between the LSI chips narrow. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
