发明名称 CHAMBER CLEANING METHOD
摘要 Provided is a chamber cleaning method capable of efficiently removing a CF-based shoulder deposit containing Si and Al deposited on an outer periphery of an ESC. A mixed gas of an O2 gas and a F containing gas is supplied toward an outer periphery 24a of an ESC 24 at a pressure ranging from about 400 mTorr to about 800 mTorr; plasma generated from the mixed gas is irradiated onto the outer periphery 24a of the ESC 24; an O2 single gas as a mask gas is supplied to the top surface of ESC 24 except the outer periphery 24a; and the shoulder deposit 50 adhered to the outer periphery 24a is decomposed and removed while preventing the top surface of ESC 24 except the outer periphery 24a from being exposed to a F radical.
申请公布号 US2011048453(A1) 申请公布日期 2011.03.03
申请号 US20100873458 申请日期 2010.09.01
申请人 TOKYO ELECTRON LIMITED 发明人 HONDA MASANOBU;HANAOKA HIDETOSHI;HIRANO TAICHI;MIMURA TAKANORI;IWATA MANABU;OKAJO TAKETOSHI
分类号 C25F5/00 主分类号 C25F5/00
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