| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which an image can be accurately acquired even by a semiconductor chip thin in chip thickness. <P>SOLUTION: In a series of processes of manufacturing the semiconductor device having a plurality of chips laminated on a substrate, a semiconductor chip warped owing to stress as a result of thinning of the semiconductor chip is flattened (STEP 8-1) by pressing a transparent correction plate before the semiconductor chip is picked up from a sheet for fixation such as a dicing tape (STEP 8-3), and the semiconductor chip is imaged in this state to confirm the position and direction, and non-defective/defective mark of the semiconductor chip (STEP 8-2). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
