| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition that is sufficiently good in any of low-temperature adhesiveness, fluidity when heated, and reliability after heat curing, and a film-shaped adhesive, an adhesive sheet, and a semiconductor device using the same. SOLUTION: The adhesive composition contains (A) an allyl-modified polyimide resin and (B) a thermosetting component, wherein the Tg of the (A) allyl-modified polyimide resin is 100°C or lower. COPYRIGHT: (C)2011,JPO&INPIT |
