发明名称 SURFACE MOUNTED ELECTRONIC COMPONENT
摘要 A surface mounted electronic component is provided. The surface mounted electronic component includes a main body, a circuit element, a conductive electrode, and a virtual electrode. The circuit element is arranged in the main body. The conductive electrode is disposed on an outer surface of the main body, wherein the conductive electrode electrically is connected to the circuit element. The virtual electrode is disposed on the outer surface of the main body, wherein the virtual electrode lies near the conductive electrode. There is a distance between the virtual electrode and the conductive electrode.
申请公布号 US2011048797(A1) 申请公布日期 2011.03.03
申请号 US20100860237 申请日期 2010.08.20
申请人 CYNTEC CO., LTD. 发明人 HUANG YI-MIN;WU TSUNG-CHAN
分类号 H01L23/49 主分类号 H01L23/49
代理机构 代理人
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