| 摘要 |
PURPOSE: A thermosetting die bond film is provided to prevent a micro void or a local concave part in a circumference part around a semiconductor device when the semiconductor element is die-bonded on an object. CONSTITUTION: A thermosetting die bond film(3) is used when a semiconductor device is manufactured. The thermosetting die bond film at least includes an epoxy resin, a phenol resin, and an acrylic copolymer. When the total weight of the epoxy resin and the phenol resin is X and the weight of the acrylic copolymer is Y, the rate X/Y is 0.7 to 5. The acrylic copolymer includes butyl acrylate of 10-60 weight% and ethylacrylate of 40-90 weight%. |
