PHOTOCURABLE RESIN COMPOSITION

摘要

Disclosed is a photocurable resin composition which has reduced hygroscopicity and can improve the cold-heat-cycle resistance of a cured product of the photocurable resin composition without deteriorating the migration resistance properties thereof when the cured product is used in a printed wiring board or the like. The photocurable resin composition comprises a carboxylic acid-containing resin, a photopolymerization initiator, an epoxidated polybutadiene compound, and a maleimide compound.