| 摘要 |
PROBLEM TO BE SOLVED: To provide a punching method for suppressing burrs caused by punching work with a metal mold in the case of forming a through hole in a film base material having a thickness of 50 μm or less by punching work. SOLUTION: In a method for punching a film base material 10, a through hole 2a is provided in the film base material 10 by using a metal mold provided with a punch 20 and a die 22. In the method for punching the film base material 10 and the metal mold, a contact surface with the film base material 10 in the die 22 is a resin layer 1. COPYRIGHT: (C)2011,JPO&INPIT
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