| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method and a grinding apparatus of a wafer capable of preventing intrusion of metal ions from a rear surface of the wafer ground and activated. SOLUTION: In this processing method of the wafer, the rear surface of the wafer having a plurality of devices on a front surface is ground, and the wafer is divided into individual devices after that. A liquefied adhesive is supplied to the rear surface of the wafer in order to form an adhesive film just after grinding the rear surface of the wafer. COPYRIGHT: (C)2011,JPO&INPIT |
