A WAFER LEVEL PACKAGE HAVING CYLINDRICAL CAPACITOR AND A FABRICATING METHOD THE SAME

摘要

PURPOSE: A wafer level package and a method of manufacturing thereof are provided to easily control the capacitance of a capacitor by adjusting the size of a cylindrical capacitor and the gap between an internal electrode and an outer electrode. CONSTITUTION: A wafer chip comprises a bonding pad(104) and an insulating layer on top A redistribution layer(108) is extended to one side of the insulating layer while being connected to the bonding pad. An outer electrode(114b) is connected to the redistribution layer while having cylindrical hollow therein. A cylindrical internal electrode is separated from the outer electrode. A dielectric layer is formed between the outer electrode and an inner electrode. A resin sealing part includes the redistribution layer to cover the internal electrode, the external electrode, and the dielectric layer.