| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning technology which can remove adhered foreign materials of the end face of a wafer without using a rotary brush which contacts the end face of the wafer. SOLUTION: An ultrasonic cleaning liquid supply unit 20 has a groove-like wall surface 22c which wraps around the end portion of a wafer 1. The ultrasonic cleaning liquid supply unit 20 is arranged so that the wall surface 22c thereof approaches the end face of the wafer, and during the rotation of the wafer 1, a cleaning liquid to which an ultrasonic vibration is applied is discharged toward the end face of the wafer from a discharge opening 25 communicating with the wall surface 22c. A film 26 of the cleaning liquid which ultrasonically vibrates is formed between the wall face 22c of the ultrasonic cleaning liquid supply unit 20 and the end face of the wafer 1. COPYRIGHT: (C)2011,JPO&INPIT
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