发明名称 THERMOELECTRIC MODULES, THERMOELECTRIC ASSEMBLIES, AND RELATED METHODS
摘要 An example thermoelectric module generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layers of the first and second laminates are at least partially removed to form electrically conductive pads on the respective first and second laminates. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together. Also disclosed is an exemplary articulated thermoelectric assembly that generally includes rigid upper laminates, thermoelectric elements mechanically and electrically coupled to each upper laminate, and an articulated lower substrate mechanically and electrically coupled to the thermoelectric elements.
申请公布号 WO2011016876(A1) 申请公布日期 2011.02.10
申请号 WO2010US25806 申请日期 2010.03.01
申请人 LAIRD TECHNOLOGIES, INC.;SMYTHE, ROBERT, MICHAEL;HERSHBERGER, JEFFREY, GERARD;HILL, RICHARD, F. 发明人 SMYTHE, ROBERT, MICHAEL;HERSHBERGER, JEFFREY, GERARD;HILL, RICHARD, F.
分类号 H01L35/32;H01L35/34 主分类号 H01L35/32
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