发明名称 POLISHING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of improving productivity while ensuring polishing quality. <P>SOLUTION: The polishing apparatus includes: a plurality of fixed abrasive grain plates 40 for lower surface plates each of which is fixed on a polishing surface 30A of the lower surface plate 30 and produced by fixing diamonds with resin so as to have an outside diameter smaller than an outside diameter of the lower surface plate 30 and a predetermined thickness; and a plurality of fixed abrasive grain plates 90 for upper surface plates each of which is fixed on a polishing surface 80A of the upper surface plate 80 and produced by fixing diamonds with resin so as to have an outside diameter smaller than an outside diameter of the upper surface plate 80 and a predetermined thickness. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011020239(A) 申请公布日期 2011.02.03
申请号 JP20090169752 申请日期 2009.07.21
申请人 KYOCERA KINSEKI CORP 发明人 KOBAYASHI KAZUJI;GOTO KATSUMI
分类号 B24B37/08;B24B37/12;B24B37/14;B24B37/27;B24B37/28;B24D3/00;B24D3/28;B24D7/06 主分类号 B24B37/08
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