| 摘要 |
A single, integral Metal Matrix Composite structure (47) includes a base plate (11), circuit layer (25), and lead supports (30,32), forming the single integral structure (47). Such a structure is particularly suited for power module applications. The various elements are well matched, thermally. Additionally, the structure (47) can be fabricated using straightforward molding processes, rather than complicated, fixtured, bonding and solder processes which are typically used for conventional power modules.
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