发明名称 COPPER ALLOY MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a copper alloy material which can obtain desired strength, electric conductivity, stress relaxation properties or the like in accordance with the components which have been added such as Ni and Si by subjecting an ingot in which the size of crystallized products and dendrite secondary arm spacing is prescribed to rolling and heat treatment, thus evading the remaining of coarse crystallized products in the final strip product.SOLUTION: The copper alloy material is obtained by subjecting a copper alloy ingot comprising, by mass, 1.0 to 5.0% Ni, 0.2 to 1.1% Si, and the balance Cu with inevitable impurities, and in which the size of crystallized products is 0.5 to 10 μm, and dendrite secondary arm spacing is 10 to 50 μm to rolling and heat treatment.
申请公布号 JP2011017073(A) 申请公布日期 2011.01.27
申请号 JP20090164249 申请日期 2009.07.10
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KAMATA CHIZUNA
分类号 C22C9/06;C22C9/00;C22C9/02;C22C9/04;C22C9/10;H01B1/02 主分类号 C22C9/06
代理机构 代理人
主权项
地址