发明名称 METHOD AND APPARATUS FOR TREATING SUBSTRATE
摘要 <p>Provided is a method for treating a substrate which comprises: a step in which a film is formed on the top surface of a substrate (10) by causing a non-corrosive liquid to flow down in film form onto the substrate (10); and a step in which the substrate (10) is conveyed through droplets (18) which surround the substrate (10), with the film having been formed on the top surface of the substrate (10) as a corrosion-resistant film. As a result, it is possible to prevent partial corrosion of the substrate (10) when the substrate (10) is being conveyed through a corrosive liquid surrounding the substrate (10) such that the substrate (10) is not treated by the liquid.</p>
申请公布号 WO2011010585(A1) 申请公布日期 2011.01.27
申请号 WO2010JP61890 申请日期 2010.07.14
申请人 SHARP KABUSHIKI KAISHA;SUMITOMO PRECISION PRODUCTS CO., LTD.;SAWADA, KOHICHI;OGATA, SHOHICHI;SUGANAGA, DAISUKE 发明人 SAWADA, KOHICHI;OGATA, SHOHICHI;SUGANAGA, DAISUKE
分类号 H01L21/677;B65G49/06;H01L21/306 主分类号 H01L21/677
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