| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing that is excellent in flame retardancy, heat resistance, a molding shrinkage ratio, flexural strength and moldability and to provide a hollow package for a semiconductor excellent in reliabilities for moisture resistance and the like.SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin represented by formula (1), (B) a phenol curing agent having a softening point of 70°C or higher, (C) an imidazole curing accelerator and (D) an inorganic filler, and has a glass transition temperature after cured of 130°C or higher. In formula (1), l is an integer of 0-10; and R-Rare the same or different and are each hydrogen or a hydrocarbon group. |
