| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a functional device which is superior in mass production and has improved performance without damaging the functional device in the manufacturing, and to provide a method of manufacturing the semiconductor device using the method of manufacturing the functional device.SOLUTION: There is provided the method of manufacturing the functional device 10 in which a hollow 5 spatially separating a part of a functional thin film 2 formed on one surface of a silicon substrate (substrate) 1 is formed in the silicon substrate 1. In the method, when forming the functional device 10 on one surface of a silicon wafer (wafer) 3 becoming a base and separating the functional device 10, an organic substance present on the one surface of the silicon wafer 3 is removed, a temporary fixing sheet 6 is stuck on the one surface of the silicon wafer 3, and a dicing sheet 7 is stuck on the other surface, the silicon wafer 3 is cut from the side of the temporary fixing sheet 6 together with the temporary fixing sheet 6. Then, the temporary fixing sheet 6 is peeled from the functional device 10 and then organic substances present on surfaces of the functional devices 10 are removed. |
