STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDING METHOD

摘要

Provided is a bonding structure excellent in conductivity and bonding property between a piezoelectric body and a metal plate. In the bonding structure in which a metal plate (1) and an electrode (3) of a piezoelectric body (2) are bonded by an electrically conductive adhesive (10) so as to have electrical conductivity, the electrically conductive adhesive (10) includes carbon blacks (12a) having an average diameter of a nano-level and has a paste form included in a non-solvent system or a solvent-based resin so that the carbon blacks form an aggregate (12) with an average diameter of 1 to 50 µm. The electrically conductive adhesive (10) is coated between the metal plate and the electrode of the piezoelectric body and the metal plate (1) and the piezoelectric body (2) are heated and pressurized so that the carbon black aggregate (12) is deformed, thereby hardening the electrically conductive adhesive (10).