| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can be free from warpage and thinned without having a core substrate.SOLUTION: The multilayer wiring substrate includes a center wiring layer 20 arranged in the center of the substrate in a thickness direction, and wiring layers 21, 22 stacked via insulating layers 31, 32 on one side and the other side with the center wiring layer 20 sandwiched. The wiring layer 21 on one side of the center wiring layer 20 and the wiring layer 22 on the other side are provided in a same layer number. The insulating layer 31 on one side of the center wiring layer 20 and the insulating layer 32 on the other side are provided in a same layer number. The center wiring layer 20 has a wiring pattern and a dummy pattern 20a, and the dummy pattern 20a is formed in a void where the wiring pattern is not arranged. |
