发明名称 Manufacturing method of optical wave guide and package board
摘要 A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.
申请公布号 KR100896522(B1) 申请公布日期 2009.05.08
申请号 KR20070092931 申请日期 2007.09.13
申请人 发明人
分类号 G02B6/13 主分类号 G02B6/13
代理机构 代理人
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