| 摘要 |
PURPOSE: A printed circuit board is provided to reduce resistance between a ground pattern and a reinforcing material by additionally forming a conductive layer between the ground pattern and the reinforcing material. CONSTITUTION: A ground pattern(20) and a circuit pattern(30) are formed on the lower side of a substrate(10). A cover layer(40) is formed on the bottom of a circuit pattern and a ground pattern to expose the part of the bottom of the ground pattern. A conductive layer is formed on the bottom of the cover layer including the bottom of the ground pattern exposed by the conductive layer. The conductive layer is made of Ag paste. A reinforcing material(60) is formed on the bottom of the conductive layer. A conductive adhesive member(50) is formed between the conductive layer and the reinforcing material.
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