发明名称 CONNECTION METHOD BY MOLDING METAL TERMINAL AND CIRCUIT BOARD, AND CONNECTION BODY
摘要 PROBLEM TO BE SOLVED: To provide a connection method capable of easily and surely performing a connection by molding between a terminal connection pattern that is provided on a circuit board, and a metal terminal.SOLUTION: A flexible circuit board 60 and a metal terminal 90 are accommodated within metal molds 150 and 200 and in that case, the terminal connection pattern that is provided on the flexible circuit board 60 and the metal terminal 90 are connected. The inside of a cavity C of the metal molds 150 and 200 formed in a portion including a connection part of the flexible circuit board 60 and the metal terminal 90 is filled with a molten resin and the resin is solidified, thereby molding a case in which the metal terminal 90 and the flexible circuit board 60 are connected and integrated. Within the cavity C of the metal molds 150 and 200, a molten resin flow blocking protrusion 203 is provided for blocking a flow of the molten resin in a direction away from the connection part of the metal terminal 90 and the flexible circuit board 60, and inflow of the molten resin to the cavity C around the connection part of the metal terminal 90 and the flexible circuit board 60 is promoted.SELECTED DRAWING: Figure 8
申请公布号 JP2016122737(A) 申请公布日期 2016.07.07
申请号 JP20140262151 申请日期 2014.12.25
申请人 TEIKOKU TSUSHIN KOGYO CO LTD 发明人 MAKINO DAISUKE;SHINOKI TAKASHI;MITSUI KOJI
分类号 H01C17/28;B29C45/14;B29C45/26;B29C45/77;H01C10/38 主分类号 H01C17/28
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