| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid-state imaging device, allowing embedding into a further miniaturized recessed part for an optical waveguide with high aspect ratio; and to provide a method for inspecting the solid-state imaging device.SOLUTION: After forming a recessed part in an insulating film at a part located above a photodiode, an embedding part is formed in the recessed part by using a high refractive index material having a refractive index higher than that of the insulating film, and then the embedding part is inspected. When the embedding part is determined to be defective in a step of inspecting the embedding part, the high refractive index material is removed, and then the embedding part is again formed in the recessed part by using the high refractive index material. |
