发明名称 TRANSPARENT RESIN COMPOSITION AND MOLDING THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a transparent resin composition excellent in heat resistance and mechanical properties and a molding of the transparent resin composition.SOLUTION: The transparent resin composition comprises 99-1 parts weight of a copolymer, which comprises (i) a repeating unit derived from a methacrylate monomer, (ii) a repeating unit derived from a vinyl aromatic monomer, and (iii) a repeating unit derived from acid anhydride, and 1-99 parts weight of at least one resin selected from an AS (acrylonitrile-styrene) resin, a PA (polyamide) resin and a PO (polyolefin) resin. The molding of the transparent resin composition is also provided.
申请公布号 JP2011006582(A) 申请公布日期 2011.01.13
申请号 JP20090151503 申请日期 2009.06.25
申请人 ASAHI KASEI CHEMICALS CORP 发明人 YONEMURA MASAMITSU;KIMURA MAYUKO
分类号 C08L33/10;C08F8/48;C08F220/18;C08L23/00;C08L25/12;C08L77/00;G02B1/04 主分类号 C08L33/10
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