| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for appropriately imaging even a minute defect, and a method of managing a semiconductor device.SOLUTION: A physical scale is formed on a scale formation surface located on the back side of an element formation surface of a substrate for forming a semiconductor element thereon (S1). A first coordinate system is created in a defect inspection device using the physical scale (S3). A defect present on the element formation surface is detected by the defect inspection device (S4). Defect location coordinates representing the location of the defect in the first coordinate system is identified (S5). A second coordinate system in a defect imaging device is created using the physical scale (S7). A region including the defect location coordinates on the second coordinate system of the element formation surface is imaged by the defect imaging device (S8, S9). |
