| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode package structure comprising a cutting slope outside.SOLUTION: The light-emitting diode package structure comprising the cutting slope outside includes: a substrate unit, a light emitting unit, a reflecting units, and a package unit. The substrate unit has a substrate body and a chip mounting region, and has cutting slopes on both sides of the substrate body, respectively. The light emitting unit has a plurality of light-emitting diode chips electrically connected on the chip mounting region. The reflecting unit has an annular reflective colloid, and the distance between the lateral side of the annular reflective colloid and the base of the cutting slope of the substrate body is between 0 mm and 1.5 mm. The annular reflective colloid forms a colloid position limiting space by surrounding the light-emitting diode chip. The package unit has a translucent package colloid used for covering the light-emitting diode chip, and the translucent package colloid is molded in the colloid position limiting space. |
