| 摘要 |
<p>An optoelectronic component is indicated, comprising a connector support (1) having a base body (12) with a top side (11), wherein the base body (12) has a thermal coefficient of expansion in at least one direction (40) of no more than 12*10-6 1/K, and a chip carrier (2), wherein the chip carrier (2) has a top side (21) on which is disposed at least one optoelectronic semiconductor chip (3) and a bottom side (22) on which is located at least one contact layer (23) connected to the at least one optoelectronic semiconductor chip (3) in an electrically conducting manner, wherein the bottom side (22) of the chip carrier (2) is fastened to the top side (11) of the connector support (1) and is connected to the connector support (1) in an electrically conducting manner by way of the at least one contact layer (23).</p> |
