发明名称 |
Integrated circuit package-in-package system with leads |
摘要 |
An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
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申请公布号 |
US7868471(B2) |
申请公布日期 |
2011.01.11 |
申请号 |
US20070854934 |
申请日期 |
2007.09.13 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;TRASPORTO ARNEL;PUNZALAN JEFFREY D.;ADVINCULA, JR. ABELARDO HADAP |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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