| 摘要 |
Provided are a method for manufacturing a flexible device, a flexible device, a flexible piezoelectric device and a flexible capacitor manufactured by the same, and a method for manufacturing a flexible sensor. A method for manufacturing a flexible device includes: laminating a first metal layer on a silicon oxide layer on a silicon substrate; laminating a device on the first metal layer; annealing the first metal layer to oxidize the first metal into a first metal oxide; etching the first metal oxide so as to separate the device from the silicon oxide layer; and transferring the separated device to a flexible substrate using a transfer layer. According to the disclosed method for manufacturing a flexible device, differently from the prior art where the silicon substrate itself is etched, the metal oxide layer laminated on the silicon substrate is etched to separate the device from the substrate. As a result, physical damage of the silicon substrate may be prevented and the cost of using the expensive single-crystal silicon substrate may be reduced.
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