| 摘要 |
PROBLEM TO BE SOLVED: To provide a detergent for silicon wafer producing processes expressing an excellent detergency to soil on a surface of a silicon wafer without impairing flatness of the silicon wafer in washing after slicing of a silicon ingot. SOLUTION: The detergent for silicon wafer producing processes comprises (A) an anionic surfactant having a weight average molecular weight of 600-200,000, (B) at least one penetrant selected from the group consisting of (B1) alkylene oxide adducts of a higher alcohol and (B2) silicone-based surfactants, and (C) an alkali as the indispensable components. COPYRIGHT: (C)2011,JPO&INPIT
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